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HomeServices & Solutions Analysis

Signal Integrity

Tools

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si-expertise

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1) Stackup Design
  • Providing suggestions to achieve better layer structure by ensuring proper reference thereby minimizing Crosstalk and EMI related issue.
  • Dielectric Material suggestion for High speed designs to minimize Channel Loss.
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2) Pre Layout Signal Integrity Analysis
  • Topology Creation
  • Determination of termination schemes, placement optimization & Trace length optimization.
  • Via designing for High speed serial links.
  • Providing Layout guidelines to Layout engineer.
  • Time Domain Analysis.
  • Transient Analysis - Validating the logic level, Drive strengths, Thresholds, Over/Under shoot, Propagation Delay, Noise margin, Slew Rate, Timing Budget (setup/Hold time).
  • Eye Diagram Analysis - Eye Opening and Jitter Validation.
  • Frequency Domain Analysis - Channel loss (IL & RL) characteristics for SERDES links.
  • NEXT & FEXT validation for SERDES signals.
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3) Post Layout Signal Integrity Analysis
  • Layout Review to ensure Best layout practice.
  • Topology extraction with Actual PCB Parasitics.
  • Time Domain Analysis.
  • Transient Analysis - Validating the logic level, Drive strengths, Thresholds, Over/Under shoot, Propagation Delay, Noise margin, Slew Rate, Timing Budget (setup/Hold time).
  • Eye Diagram Analysis - Eye Opening and Jitter Validation.
  • Crosstalk level estimation for Parallel bus interface signals.
  • Frequency Domain Analysis - Channel loss (IL & RL) characteristics for SERDES links.
  • NEXT & FEXT validation for SERDES signals.
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Power integrity Analysis

1) DC Drop Analysis
  • Analyzing power distribution networks to validate IR Drop caused due to losses present in conduction materials and layout constraints.
  • Results indicating current density and voltage values at each power pins of circuit devices.
  • 3D plot generation representing voltage and current distribution through the power planes.
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2) Decoupling Analysis
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  • Analyzing impedance response of power distribution network at multiple board locations across a broad range of frequencies.
  • Optimizing the usage of capacitors based on performance and placement on the board.
  • Stackup suggestions for proper board decoupling.
3) Plane Noise Analysis
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  • Analyzing Simultaneous Switching Noise created in power distribution networks due to high switching frequencies.
  • Ensuring optimum decoupling to reduce noise (power bounce and ground bounce) coupling effects.

EMI-Analysis

  • Far field net level radiated emissions spectrum generated considering a single signal at a time helps in identification of the emission level from the trace geometries at required distance from the source and provides provision to compare with emission standards.
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Thermal analysis

1) Board level Thermal Analysis
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  • Embedding thermal parameters along with surrounding environment and boundary conditions.
  • Simulation performed for all ambient temperature conditions.
  • Results include Component temperature profile, Board temperature profile and Board gradient results to understand the overall thermal behaviour of the board.
  • Modelling heat sinks and thermal plates to ensure proper heat dissipation.
2) System Level Thermal Analysis
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  • Environmental Conditions.
  • Pre-Simulation Analysis and the benefits of the first law of thermodynamics.
  • Modes of Heat transfer and the effect on System Level.

RELIABILITY ANALYSIS

PTC Windchill quality solutions

1) MTBF Reliability Analysis
  • Embedding component parameters like temperature and current rating.
  • Simulation performed for all environment conditions.
  • Mean Time Between Failure (MTBF) study.
  • Simulation is performed to calculate the Failure rate of the system .
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